Advanced MaterialsRequest a QuoteApplications
Start with the system constraint.
When the part is not fully specified, begin with the heat flux, wavelength, power density, environment or wear condition. We use that context to frame the diamond grade and processing route.
AI & High-Performance Computing
Extract heat from GPU, CPU and ASIC packages with diamond heat spreaders engineered for the interface.
- Heat spreaders
- Advanced packaging
- Hotspot mitigation
Photonics & High-Power Lasers
Protect optical performance at high power density with low-absorption windows and thermally efficient submounts.
- Laser diode submounts
- Optical windows
- Beam delivery
RF & GaN Electronics
Reduce junction temperature and unlock higher power density in RF amplifiers and GaN devices.
- GaN-on-diamond
- RF power amplifiers
- LDMOS
Power Electronics
Thermal interfaces and substrates for SiC, IGBT and next-generation power modules.
- SiC devices
- Power modules
- Thermal plates
Quantum & Sensing
NV-engineered and high-purity diamond matched to quantum and detector requirements.
- NV centres
- Magnetometry
- Detector substrates
Precision Manufacturing
Hardness, wear resistance and nanometre-scale finishing for demanding production systems.
- Tool blanks
- Wear parts
- Ultra-precision surfaces