Heat spreaders
Material grade, geometry and interface are matched to operating conditions and the assembly route.
Advanced MaterialsRequest a QuoteApplication engineering
AI & High-Performance Computing
Extract heat from GPU, CPU and ASIC packages with diamond heat spreaders engineered for the interface.
Discuss your application
Recommended starting category
Thermal Management
The final product is selected from the operating requirement, not the image alone. Use this category as the first technical route, then confirm grade, geometry, finishing and interfaces through the RFQ.
See category specificationsFocus areas
Diamond where system performance is constrained.
Advanced packaging
Material grade, geometry and interface are matched to operating conditions and the assembly route.
Hotspot mitigation
Material grade, geometry and interface are matched to operating conditions and the assembly route.
Useful RFQ inputs
What helps us frame the first specification.
- 01Heat flux and hotspot area
- 02Die and package dimensions
- 03Electrical isolation requirement
- 04Target junction temperature
How Adamasm works
Application first. Material second.
We begin with heat flux, wavelength, power density, interface, environment and production constraints. Then we qualify the crystal form and processing route across our manufacturing network. That keeps procurement focused on a component that works—not a catalogue specification in isolation.