GaN-on-diamond
Material grade, geometry and interface are matched to operating conditions and the assembly route.
Advanced MaterialsRequest a QuoteApplication engineering
RF & GaN Electronics
Reduce junction temperature and unlock higher power density in RF amplifiers and GaN devices.
Discuss your application
Recommended starting category
Thermal Management
The final product is selected from the operating requirement, not the image alone. Use this category as the first technical route, then confirm grade, geometry, finishing and interfaces through the RFQ.
See category specificationsFocus areas
Diamond where system performance is constrained.
RF power amplifiers
Material grade, geometry and interface are matched to operating conditions and the assembly route.
LDMOS
Material grade, geometry and interface are matched to operating conditions and the assembly route.
Useful RFQ inputs
What helps us frame the first specification.
- 01Device technology and footprint
- 02Peak / average dissipation
- 03Bonding and metallization route
- 04Package-level thermal target
How Adamasm works
Application first. Material second.
We begin with heat flux, wavelength, power density, interface, environment and production constraints. Then we qualify the crystal form and processing route across our manufacturing network. That keeps procurement focused on a component that works—not a catalogue specification in isolation.